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Tantalum Nitride - TaN

Tantalum Nitride - TaNTantalum Nitride is an usually compound, It was used in many kinds of industry. CRM supply some products of Tantalum Nitride. Include sputtering target, evaporation material, powder( high pure, or usually pure)

Tantalum Nitride - TaNTantalum nitride (TaN) is an inorganic chemical compound. It is sometimes used tocreate barrier or "glue" layers between copper, or other conductive metals, and dielectric insulator films such as thermal oxides. These films are deposited on topofsilicon wafers during the manufacture of integrated circuits, to create thin film surface mount resistors andhas other electronic applications.

Base information

Other names:Tantalum mononitride
CAS Number:12033-62-4

ECHA InfoCard:100.031.613
EC Number:234-788-4
PubChem CID:82832
Chemical formula:TaN

Molar mass:194.955 g/mol

Appearance:black crystals
Density:14.3 g/cm3
Melting point:3,090 °C (5,590 °F; 3,360 K)
Solubility in water:insoluble
Crystal structure:Hexagonal, hP6
Space group:P-62m, No. 189

Tantalum Nitride Sputtering targets - TaN

Purity - 99.5%

Shape - Discs, Plate, Step ( Dia ≤480mm, Thickness ≥1mm )

Rectangle, Sheet, Step ( Length ≤300mm, Width ≤200mm, Thickness ≥1mm )

Tube ( Diameter< 300mm, Thickness >2mm )

Application - Coating

Tantalum Nitride Evaporation Material - TaN

Purity - 99.5%

Granule - 1-6mm

Application - Coating

Tantalum Nitride Powder - TaN

Purity --- 99.5%

Granularity --- 300 mesh

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Aluminum Nitride (AlN) Sputtering Targets;

Boron Nitride (BN) Sputtering Targets;

Chrominium Nitride (CrN) Sputtering Targets;

Gallium Nitride (GaN) Sputtering Targets;

Germanium Nitride (Ge3N4) Sputtering targets;

Hafnium Nitride (HfN) Sputtering Targets;

Magnesium Nitride (Mg2N3) Sputtering Targets;

Niobium Niride (NbN) Sputtering Targets;

Silicom Nitride (Si3N4) Sputtering Targets;

Tantalum Nitride (TaN) Sputtering Targets;

Titanium Carbonitride (TiCN);

Titanium Nitride(TiN) Sputtering Targets;

Vanadium Nitride (VN) Sputtering Targets;

Zirconium Nitride (ZrN) Sputtering Targets;





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