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Your current location :Home > Titanium Nitride (TiN)

Titanium Nitride (TiN)

Titanium nitride ( TiN)Titanium nitride (TiN) (sometimes known as tinite) is an extremely hard ceramic material, often used as a coating on titanium alloys, steel, carbide, and aluminium components to improve the substrate's surface properties.

Applied as a thin coating, TiN is used to harden and protect cutting and sliding surfaces, for decorative purposes (due to its gold appearance), and as a non-toxic exterior for medical implants. In most applications a coating of less than 5 micrometres (0.00020 in) is applied.

TiN has a Vickers hardness of 2400, a modulus of elasticity of 251 GPa, a thermal expansion coefficient of 9.35×10−6 K−1, and a superconducting transition temperature of 5.6 K.

TiN will oxidize at 800 °C in a normal atmosphere. It is chemically stable at 20 °C, according to laboratory tests, but can be slowly attacked by concentrated acid solutions with rising temperatures.

TiN has infrared (IR) reflectivity properties, reflecting in a spectrum similar to elemental gold (Au), which gives it a yellowish color. Depending on the substrate material and surface finish, TiN will have a coefficient of friction ranging from 0.4 to 0.9 against another TiN surface (non-lubricated). The typical TiN formation has a crystal structure of NaCl-type with a roughly 1:1 stoichiometry; TiNx compounds with x ranging from 0.6 to 1.2 are, however, thermodynamically stable. A thin film of TiN was chilled to near absolute zero, converting it into the first known superinsulator, with resistance suddenly increasing by a factor of 100,000.

Base information

IUPAC name:Titanium nitride

CAS Number:25583-20-4

ECHA InfoCard:100.042.819
EC Number:247-117-5
PubChem CID:93091

Chemical formula:TiN
Molar mass;61.874 g/mol
Appearance:Coating of golden color

Odor:Odorless

Density:5.22 g/cm3
Melting point:2,930 °C (5,310 °F; 3,200 K)
Solubility in water:insoluble
Magnetic susceptibility (χ):+38×10−6 emu/mol
Thermal conductivity: 19.2 W/(m·°C)

Crystal structure:Cubic, cF8
Space group:Fm3m, No. 225

TiN sputtering TargetTitanium Nitride (TiN) Sputtering Target

Purity --- 99.5%

Shape --- Discs, Plate,Step (Dia ≤480mm, Thickness ≥1mm)

Rectangle, Sheet, Step (Length ≤360mm, Width ≤360mm, Thickness ≥1mm)

Tube( Diameter< 300mm, Thickness >2mm )

Application --- Titanium films are becoming more widely used as passivation layers for VLSI, decorative gold coatings, and wear coatings. A reactive sputtering process can deposit titanium nitride films with excellent electrical, mechanical, and optical properties. 

Titanium Nitride (TiN) Evaporation Materials

Purity --- 99.5%

Shape --- Granule 1-3mm, 1-6mm, 2-6mm

Application---additive in cemented carbides, ceramic, spraying coating raw material...

Titanium Nitride (TiN) Powder

Purity --- 99.5%

Shape --- Powder,40-300mesh

Application --- additive in cemented carbides, ceramic, spraying coating raw material...

Titanium Nitride (TiN) Nanometer Powder

Purity---97% Oxygen content --- <1.0wt%

Color --- black Crystallographic form --- Cube Morphology---spherical

Average particle size (D50) --- <14nm

Specific surface area --- >80m2/g

Apparent density --- 0.08g/cm3

Manufacture method --- Plasma arc vapor 

Application --- Barrier layer in contact and interconnect metallizations, Bio-materials, Cutting tools, Forming tools, Gate electrode in metal-oxide-semiconductor (MOS) transistors, Low-barrier Schottky diode, Nanocomposites, Optical devices in aggressive, environments, Plastic molds, Prostheses, Surgical instruments, high temperatures crucibles and decorate materials, wear-resistant coating...

Relation Products:

Aluminum Nitride (AlN) Sputtering Targets;

Boron Nitride (BN) Sputtering Targets;

Chrominium Nitride (CrN) Sputtering Targets;

Gallium Nitride (GaN) Sputtering Targets;

Germanium Nitride (Ge3N4) Sputtering targets;

Hafnium Nitride (HfN) Sputtering Targets;

Magnesium Nitride (Mg2N3) Sputtering Targets;

Niobium Niride (NbN) Sputtering Targets;

Silicom Nitride (Si3N4) Sputtering Targets;

Tantalum Nitride (TaN) Sputtering Targets;

Titanium Carbonitride (TiCN) Sputtering targets;

Titanium Nitride(TiN) Sputtering Targets;

Vanadium Nitride (VN) Sputtering Targets;

Zirconium Nitride (ZrN) Sputtering Targets;

 

 

 

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